Product

Technologic High-Flyer

BONDER

Driver IC BONDER(OLB)

Equipment attaching ACF to COF and bonding this COF to a panel by heat and pressure

AOC Bonder, Mold Press, Sharing Stage

Specification

SPECIFICATION
Corresponding Panel Size 21" ~ 58"
Applicable Material Glass Panel, ACF, Silicone Sheet, TAB IC
Tact Time 13sec (Process time: ACF 0.7 sec, Pre-compression: 0.1 sec, Main compression: 5secs)
Line length 18,000mm(L) x 3,850(W) x 2,100mm(H)
Weight 25,000Kg