X-RAY IC BONDER
Possible to respond to four-side rework bonding <br />Addition of a function minimizing rear scratch using air floatation
Equipment bonding TAB-IC and PCB to medium and large panels with ACF attached.
Equipment performing rework for the defects (TAB & PCB) occurred during the production and R&D processes.
|Applicable TAB(COF) |
|(more than) 35㎛|
|Distance between TAB (COF) Marks||More than min. 18mm|
|PCB JIG||Using a specialized or general jig|
|Size||4,900mm(W) x 1,720mm(D) x 1,800mm(H)|