Product
Technologic High-Flyer
BONDER
X-RAY IC BONDER
Possible to respond to four-side rework bonding <br />Addition of a function minimizing rear scratch using air floatation
Equipment bonding TAB-IC and PCB to medium and large panels with ACF attached.
Equipment performing rework for the defects (TAB & PCB) occurred during the production and R&D processes.
Specification
| Panel Size | 250x250mm~475x475mm |
|---|---|
| Panel Thickness | 0.7~2mm |
| Applicable TAB(COF) LEAD PITCH | (more than) 35㎛ |
| Distance between TAB (COF) Marks | More than min. 18mm |
| PCB JIG | Using a specialized or general jig |
| Size | 4,900mm(W) x 1,720mm(D) x 1,800mm(H) |
| Weight | 3,500Kg |