Product

Technologic High-Flyer

BONDER

T-FOF BONDER

Equipment bonding MFPC and TFPC using ACF

Possible to respond to the general models without jig replacement

Specification

SPECIFICATION
Possible to respond
to the general models
without jig replacement
Min. 3"~ Max. 6.5"
Applicable Material ACF, Silicone Sheet, Teflon Sheet, Tray
Tact Time 3.6sec (Process time ACF : 1sec, PRB : 0.2sec, FNB : 6sec)
Applicable FPCB length X 10~100mm / Y 20~150mm (MFPCB)
Size 5,500mm(W) x 1,800mm(D) x 1,800mm(H)
Weight 5,400Kg