Product
Technologic High-Flyer
BONDER
T-FOF BONDER
Equipment bonding MFPC and TFPC using ACF
Possible to respond to the general models without jig replacement
Specification
| Possible to respond to the general models without jig replacement |
Min. 3"~ Max. 6.5" |
|---|---|
| Applicable Material | ACF, Silicone Sheet, Teflon Sheet, Tray |
| Tact Time | 3.6sec (Process time ACF : 1sec, PRB : 0.2sec, FNB : 6sec) |
| Applicable FPCB length | X 10~100mm / Y 20~150mm (MFPCB) |
| Size | 5,500mm(W) x 1,800mm(D) x 1,800mm(H) |
| Weight | 5,400Kg |