Product
Technologic High-Flyer
BONDER
PCB BONDER(Single Span)
Equipment bonding to a PCB (Printed Circuit Board) by applying the proper heat and pressure for the process after implementing pattern alignment using a vision inspection system through the vehicles such as ACF (separate equipment is used for ACF bonding)
Specification
| Tool width (material) | 1.5, 2.0㎜ (Cemented carbide) |
|---|---|
| Tool length | 80㎜ |
| Workable temperature | Max.380℃ |
| Applicable PCB size | Width : 15~120㎜ , Length : 10~80㎜ |
| Applicable PCB thickness | 0.3~2.7㎜ |
| LEAD PITCH | 200㎛ ~ 700㎛ |
| Existence of backup heater | A backup heater must exist. |