Product
Technologic High-Flyer
BONDER
OLB BONDER(Single Span)
Equipment bonding a COF(Chip On Flexible Printed Circuit) manually-supplied on monitor by applying the proper heat and pressure for the process using a vision inspection system after pre-bonding (by using separate equipment) an ACF (Anisotropic Conductive Film) on a glass panel or film.
Specification
| TOOL width (Material) | 0.8, 1.0㎜ (Cemented carbide), 1.5, 2.0㎜ (SUS440C) |
|---|---|
| Tool length | 100㎜ |
| Workable temperature | Max.380℃ |
| Applicable CELL SIZE | Width : 15~120㎜ , Length : 10~80㎜ |
| Applicable CELL THICKNESS | 0.3/0.4/0.55 X 2㎜ or 2.7 |
| LEAD PITCH | 75㎛ ~ 150㎛ |
| Existence of backup heater | A backup heater must exist. |