Product

Technologic High-Flyer

BONDER

FPCB BONDER

Semi-Auto

Equipment bonding FPCB to a flexible display using the proper temperature (heat) and pressure for the process

Specification

SPECIFICATION
PROJECT NameYOUM FOG BONDER (7"~17")
Production lead timeWithin 90 days after placing an order (To be installed at the place designated by customer)
Equipment SizeTotal length: 3,700mm(W) X 1,500mm(D) X 2,100mm(H)
Equipment weightAbout 3,260kg
Applicable material sizePanel: Min. 86.8 X 140 / Max. 380 X 400
TACT TIMEManually-operated equipment (Semi Auto)
Material transfer1
FFUPerformance: 0.1 ~ 0.5 m/s, Filter efficiency: 99.9999% ⓐ 0.12um
AIR UTILITYAir consumption: 900L/min, Line air: 12Ф x 3
Power3 phase AC220V 60Hz 20KVA
Bonding accuracyPre AlignX-Axis : ±7㎛ , Y-Axis : ±7㎛
Rinal BonderX-Axis : ±10㎛ , Y-Axis : ±20㎛
ThrustACF pre-bonding 2.5~20 Kg/f
Final Bonder80Kg/f
Equipment safetyCE MARK certification