Product
Technologic High-Flyer
BONDER
FPCB BONDER
Semi-Auto
Equipment bonding FPCB to a flexible display using the proper temperature (heat) and pressure for the process
Specification
| PROJECT Name | YOUM FOG BONDER (7"~17") | ||
|---|---|---|---|
| Production lead time | Within 90 days after placing an order (To be installed at the place designated by customer) | ||
| Equipment Size | Total length: 3,700mm(W) X 1,500mm(D) X 2,100mm(H) | ||
| Equipment weight | About 3,260kg | ||
| Applicable material size | Panel: Min. 86.8 X 140 / Max. 380 X 400 | ||
| TACT TIME | Manually-operated equipment (Semi Auto) | ||
| Material transfer | 1 | ||
| FFU | Performance: 0.1 ~ 0.5 m/s, Filter efficiency: 99.9999% ⓐ 0.12um | ||
| AIR UTILITY | Air consumption: 900L/min, Line air: 12Ф x 3 | ||
| Power | 3 phase AC220V 60Hz 20KVA | ||
| Bonding accuracy | Pre Align | X-Axis : ±7㎛ , Y-Axis : ±7㎛ | |
| Rinal Bonder | X-Axis : ±10㎛ , Y-Axis : ±20㎛ | ||
| Thrust | ACF pre-bonding | 2.5~20 Kg/f | |
| Final Bonder | 80Kg/f | ||
| Equipment safety | CE MARK certification | ||