Product
Technologic High-Flyer
BONDER
CAMERA MODULE BONDER(Single Span)
Equipment bonding by implementing alignment using a vision inspection system and then applying proper heat and pressure for the process after pre-bonding (a separate equipment is used) an ACF (Anisotropic Conductive Film) to the backside of a camera
The jig and head of a camera module can be exchanged according to the material size (Option).
Specification
| TOOL width (Material) | 8, 10㎜ (SUS440C) |
|---|---|
| Tool length | 10㎜ |
| Workable temperature | Max.300℃ |
| Applicable CELL SIZE | Width : 8, 10㎜ , Length : 8, 10㎜ |
| Applicable CELL THICKNESS | 2.7 |
| LEAD PITCH | 300㎛ ~ 500㎛ |