Product

Technologic High-Flyer

BONDER

ACF BONDER(Single Span)

Equipment pre-bonding an ACF (Anisotropic Conductive Film) on a glass panel or PCB (Printed Circuit Board)
Option: 2 layer, 3layer, Slice sheet collection method option: 1) ROLL , 2) Vacuum

Specification

SPECIFICATION
PANEL SIZELength : 60 ~ 150㎜, 1.5, Width : 50 ~ 200㎜
PANEL THICKNESS1㎜ ~ 3㎜
External diameter of ACF (㎜)Max. Ф300
ACF structureApplied to 2 layer only.
ACF width (㎜)0.8, 1.0, 1.2, 1.5, 2.0, 10㎜